The main activities are listed below:
- Specification of frequency range, antenna performance, radar architecture and radar frontend performance
- Tape-out of first mm-Wave circuits in 22FDX MPW
- Validation of mm-Wave chips in lab
- Tape-out of second mm-Wave ICs in 22FDX MPW
- Validation of radar frontend in package
- Tape-out of first digital circuits in 22FDX MPW
- Validation of digital IC in lab
- Tape-out of second digital ICs in 22FDX MPW
- Validation of radar frontend in package together with digital IC
- Circuit process variation analysis and optimization
- Package & antenna technology development
- Package Material and Integration Technology Characterization
- Antenna array fabrication